Open Access Open Access  Restricted Access Subscription or Fee Access

Analysis of PCB Cooling

Chaudhari Swetubhai, Patel Ravi, Patel Dhruv


A complete numerical simulation is performed for PCB cooling using MatLab. Suitable algorithm is developed in order to find out important parameters involved and temperature of PCB. This exercise has been performed to develop an analytical procedure finding out the temperature of PCB and assure safe temperature of PCB has been reached. This is necessary to avoid failure of electronic circuits due to heat rise when processing data is more. A suitable parametric analysis is performed to understand the effects of changing various parameters on temperature of PCB.


PCB cooling, simulations, heat transfer, temperature of PCB

Full Text:



Puttaswamy K, Loh GH. Thermal analysis of a 3D die-stacked high-performance microprocessor. InProceedings of the 16th ACM Great Lakes symposium on VLSI 2006 Apr 30 (pp. 19–24).

Wang B, Mazumder P. Fast thermal analysis for VLSI circuits via semi-analytical Green's function in multi-layer materials. In2004 IEEE International Symposium on Circuits and Systems (IEEE Cat. No. 04CH37512) 2004 May 23 (Vol. 2, pp. II-409). IEEE.

Janicki M, Napieralski A. Modelling electronic circuit radiation cooling using analytical thermal model. Microelectronics Journal. 2000 Oct 1;31(9–10):781–5.

Lemczyk TF, Mack BL, Culham JR, Yovanovich MM. PCB trace thermal analysis and effective conductivity. Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE, 1991.

Veziroglu TN, Chandra S. Thermal conductance of two-dimensional constrictions. InThermal Design Principles of Spacecraft and Entry Bodies. Academic Press. 1969:591–615.

Yovanovich MM, Muzychka YS, Culham JR. Spreading resistance of isoflux rectangles and strips on compound flux channels. Journal of thermophysics and heat transfer. 1999 Oct;13(4):495–500.

Kokkas AG. Thermal analysis of multiple-layer structures. IEEE Transactions on Electron Devices. 1974 Nov;21(11):674–81.

Fedorov AG, Viskanta R. Three-dimensional conjugate heat transfer in the

microchannel heat sink for electronic packaging. International Journal of Heat and Mass Transfer. 2000 Feb 1;43(3):399–415.

Peles Y, Koşar A, Mishra C, Kuo CJ, Schneider B. Forced convective heat transfer across a pin fin micro heat sink. International Journal of Heat and Mass Transfer. 2005 Aug 1;48(17):3615–27.

Muzychka YS, Culham JR, Yovanovich MM. Thermal spreading resistance of eccentric heat sources on rectangular flux channels. J. Electron. Packag.. 2003 Jun 1;125(2):178–85.

Zografos AI, Sunderland JE. Natural convection from pin fin arrays. Experimental Thermal and Fluid Science. 1990 Jul 1;3(4):440–9.



  • There are currently no refbacks.